Uniform smart soldering increases the power and efficiency of the module, and improves the power load capacity.
Optimized Module Size
Large-format modules with M10 wafer size use dual-glass and frame packaging to ensure module strength.
Smart Module Packaging and Logistics
Smart module packaging solutions are used to achieve high reliability, low-cost transportation and logistics.
Bifacial Energy Yield
Additional power generation from the backside of bifacial modules increases the overall energy yield, which has been verified by customers and third-party testing organizations.
Gallium-doped technology overcomes LID degradation and guarantees the long-term power generation of the module.
Optimized Electrical Parameters
The working current is about 13A, which is perfectly adapted to mainstream string inverters.